Punto d'origine
Hunan, China
Video in uscita-ispezione
Fornito
Macchine Rapporto di Prova
Fornito
Componenti di base
PLC, Motore, Cuscinetto, Cambio, Motore, Recipiente a pressione, Gear, Pompa
Chiave di Punti di Vendita
Ad alta precisione
Application
semiconductor Silicon Carbide/Sapphire/Ceramic
Max Diameter of grinding workpiece
360mm
Min Thickness of Grinding Workpiece
0.2mm
Max Working Pressure
500Kg
Flatness of Lapping Disc
0.008mm
Lapping Disc Size
Diameter 1127x397x50mm
Max Rotation Speed of Upper/Lower Plate
60R/min
Machine Type
Double Sided Lapping Polishing Machine
QTY of Feeding Carrier
5Pcs